Grain Growth in Dynamically Recrystallized Copper During Annealing above and below the Temperature of Thermally Activated Nucleation

M. V. Degtyarev; T. I. Chashchukhina; L. M. Voronova

doi:10.17804/2410-9908.2016.5.015-029

M. V. Degtyarev, T. I. Chashchukhina, L. M. Voronova

GRAIN GROWTH IN DYNAMICALLY RECRYSTALLIZED COPPER DURING ANNEALING ABOVE AND BELOW THE TEMPERATURE OF THERMALLY ACTIVATED NUCLEATION

DOI: 10.17804/2410-9908.2016.5.015-029

The effect of dynamic recrystallization on the change of the structure of copper (99.97 %), deformed by the "shear under pressure" and ECAP methods, during subsequent heating is studied. It is shown that different conditions of deformation of copper provide varying degrees of dynamic recrystallization, dynamic recovery and strain hardening. A submicrograin structure fails to be formed after primary recrystallization is completed. Dynamic recrystallization leads to the formation of the coarsest grain (15-20 μm) and size heterogeneous structure during subsequent recrystallization at 100 °C (below the temperature of thermally activated nucleation in moderately deformed copper). Heating at temperatures ranging between 150 °C and 400 °C (above the temperature of thermally activated nucleation) leads to the formation of finer grains in the fully recrystallized material. In samples with a partially dynamically recrystallized structure the grain size changes insignificantly. The finest grain with an average size of 4-7 μm is formed after short-time annealing at 300 °C.

Keywords: severe plastic deformation, copper, temperature-compensated strain rate, dynamic recrystallization, static recrystallization, structure

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М. В. Дегтярев, Т. И. Чащухина, Л. М. Воронова

РОСТ ЗЕРНА В ДИНАМИЧЕСКИ РЕКРИСТАЛЛИЗОВАННОЙ МЕДИ ПРИ ОТЖИГЕ ВЫШЕ И НИЖЕ ТЕМПЕРАТУРЫ ТЕРМОАКТИВИРОВАННОГО ЗАРОЖДЕНИЯ

Исследовано влияние динамической рекристаллизации на изменение при последующем нагреве структуры меди марки М0б, деформированной методами «сдвиг под давлением» и РКУП. Показано, что разные условия деформации меди обеспечивают различную степень развития динамической рекристаллизации, динамического возврата и деформационного упрочнения. По завершении первичной рекристаллизации не удается получить субмикрозернистую структуру. Динамическая рекристаллизации приводит к формированию наиболее крупнозернистой (15–20 мкм) и размерно неоднородной структуры при последующей статической рекристаллизации, осуществляемой при 100 °С (ниже температуры термоактивированного зарождения в умеренно деформированной меди). Нагрев в интервале 150–400 °С (выше температуры термоактивированного зарождения) приводит к формированию более мелкого зерна в полностью динамически рекристаллизованном материале и мало меняет размер зерна в образцах с частично динамически рекристаллизованной структурой. Наиболее мелкое зерно средним размером 4–7 мкм формируется после кратковременного отжига при 300 °С.

Ключевые слова: большая пластическая деформация, медь, температурно-скомпенсированная скорость деформации, динамическая рекристаллизация, статическая рекристаллизация, структура

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Библиографическая ссылка на статью

Degtyarev M. V., Chashchukhina T. I., Voronova L. M. Grain Growth in Dynamically Recrystallized Copper During Annealing above and below the Temperature of Thermally Activated Nucleation // Diagnostics, Resource and Mechanics of materials and structures. - 2016. - Iss. 5. - P. 15-29. -
DOI: 10.17804/2410-9908.2016.5.015-029. -
URL: http://dream-journal.org/issues/2016-5/2016-5_91.html
(accessed: 21.12.2024).